![]() ![]() Interconnects – the tiny wiring schemes in chips’ back-end-of-line (BEOL) – distribute clock and other signals, provide power and ground for various electronic system components, and interconnect the transistors within the chips’ front-end-of-line (FEOL). Interconnect technologies: what’s in production today? Zsolt Tokei, program director of nano-interconnects at imec, sheds light on these innovations – which have been presented at imec’s ITF USA and at the latest IITC conference. Imec sees single-print EUV in dual-damascene modules, Supervia structures, semi-damascene modules and added functionality in the back-end-of-line (BEOL) as the way forward. Extending interconnects towards the 3nm technology node and beyond requires several innovations. ![]()
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December 2022
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